Blanking aperture array and method of producing same

Details Blanking aperture array and method of producing same Blanking aperture array and method of producing same

1991-04-16

1993-06-01

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156643, 156653, 156656, 156657, 1566591, 156662, 156345, 21912112, 257618, 428137, 430 5, 437203, 437228, 437238, 437245, H01L 21306, B44C 122, C03C 1500, C23F 100

Patent

active

052156230

ABSTRACT:
A blanking aperture array for use in an electron beam exposure system and a method of producing the same. An electrode layer is formed on a substrate having shift register devices, and then an electron beam aperture is formed, extending as an aligned aperture and associated opening through the substrate and electrode layer, respectively, to thereby effectively form a deep electron beam aperture.

REFERENCES:
patent: 3447984 (1969-06-01), Castrucci et al.
patent: 4021276 (1977-05-01), Cho et al.
patent: 4417946 (1983-11-01), Bohlen et al.
patent: 4589952 (1986-05-01), Behringer et al.
Patent Abstracts of Japan, vol. 9, No. 219 (M-4101)[1942], Sep. 6, 1985; & JP-A-60 081 750 (Nippon Denki) Sep. 5, 1985.
Patent Abstracts of Japan, vol. 9, No. 219 (M-410)[1942], Sep 6, 1985; & JP-A-60 081 751 (Nippon Denki K.K.) Sep. 5, 1985.
Microelectric Engineering, vol. 9, No. 1-4, May 1989, Amsterdam, NL, pp. 205-208; U. Schnakenberg et al.: "Multi Electron Beam Lithography: Fabrication of a Control Unit".

Affiliated with

Also associated with

Rating

Blanking aperture array and method of producing same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Blanking aperture array and method of producing same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Blanking aperture array and method of producing same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1811978