Blanket tungsten deposition for dielectric

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427299, 427314, B05D 306

Patent

active

047770619

ABSTRACT:
A process is disclosed for depositing tungsten non-selectively on conductors and dielectrics without the use of an adhesive interlayer. The process comprises an argon pre-treatment followed by low power plasma deposition to nucleate the tungsten. A thick, adherent layer of tungsten is then deposited.

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