Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2006-09-27
2009-08-11
Pham, Thanhha (Department: 2894)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C438S216000, C438S591000, C438S745000, C257SE21487
Reexamination Certificate
active
07572735
ABSTRACT:
Yield loss in semiconductor processing is mitigated by forming a resist over an active side of a semiconductor workpiece or wafer, as well as around the edge of the wafer. The resist mitigates the creation of contaminants, such as nitride flakes, for example, that can develop when an oxide, nitride, oxide (ONO) layer is removed from the back or in-active side of the wafer. In the absence of the resist, such flakes may migrate to the front or active side of the wafer and cause defects to form therein, which can result in yield loss.
REFERENCES:
patent: 2002/0064960 (2002-05-01), Hoepfner
Fenstermacher Keith David
Hazelton Courtney Michael
Nguyen Scott Cuong
Smith David Michael
Brady III Wade J.
Pham Thanhha
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
LandOfFree
Blanket resist to protect active side of semiconductor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Blanket resist to protect active side of semiconductor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Blanket resist to protect active side of semiconductor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4116319