Blank beam leads for IC chip bonding

Details Blank beam leads for IC chip bonding Blank beam leads for IC chip bonding

1979-06-18

1981-01-27

Brammer, Jack P.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

228180A, 430277, 430281, 430288, 430312, 430326, 430502, 430910, 430952, G03C 194

Patent

active

042476232

ABSTRACT:
A three-layer blank and a process are disclosed for the formation of frames of metal beam leads that are bonded to integrated circuit chips. The blank incorporates an improved negative-working resist having adhesion to the metal as well as flexibility. The process of forming the leads includes the step of fully photopolymerizing the resist to avoid outgassing of residual monomer as would otherwise occur during bonding.

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patent: 3763804 (1973-10-01), Airn
patent: 3795043 (1974-03-01), Fortani
patent: 3804631 (1974-04-01), Faust
patent: 3960572 (1976-06-01), Ibata et al.
patent: 4054479 (1977-10-01), Peiffer
patent: 4079509 (1978-03-01), Jackson et al.
Grossman, Electronics, 5/16/74, pp. 89-95.

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