Bipolar transistor FINFET technology

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S382000, C257S385000, C438S189000, C438S202000

Reexamination Certificate

active

07834403

ABSTRACT:
This document discusses, among other things, apparatus having at least one CMOS transistor overlying a substrate; and at least one finned bipolar transistor overlying the substrate and methods for making the apparatus.

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“Restriction Requirement Received”, Restriction Requirement Received, Restriction Requirement Received, 4 pages Aug. 10, 2009.
Hisamoto, “FinFET—A self-aligned double-gate MOSFET scalable to 20 nm”,IEEE Transactions on Electron Devices, 47(12), (Dec. 2000).
Pellizzer, F, et al., “A 90nm Phase Change Memory Technology for Stand-Alone Non-Volatile Memory Applications”,Symposium on VLSI Technology, Digest of Technical Papers, (2006), 2 pgs.
Tilke, Armin T, et al., “Quarter micron BiCMOS technology platform with implanted-base- or SiGe-bipolar transistor for wireless communication ICs”,Solid-state electronics, 48(12), (2004), 2243-2249.
Tomislav Suligoj, Haitao Liu, Johnny K.O. Sin, Kenneth Tsui, Rongming Chu, Kevin J. Chen, Petar Biljanovic, Kang L. Wang; A low-cost horizontal current bipolar transistor (HCBT) technology for the BiCMOS integration with FinFETs; Received Dec. 10, 2003; accepted Mar. 15, 2004; Solid-State Electronics 48 (2004); pp. 2047-2050.

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