Bipolar transistor and semiconductor device using same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S370000, C257S567000, C257SE29178, C257SE29178, C257SE31131, C257SE31062

Reexamination Certificate

active

11079778

ABSTRACT:
A bipolar transistor is provided, which is low in collector-to-emitter saturation voltage, small in size and to be manufactured by a reduced number of processes, and a semiconductor device formed with such a bipolar transistor and a MOS transistor on a same substrate. A high concentration region for reducing the collector-to-emitter saturation voltage VCE(sat) is formed in a manner surrounding a base region of an NPN transistor. This high concentration region is not necessarily formed in such a depth as reaching a buried layer, and can be reduced in the spread in a lateral direction. Because a high concentration region can be formed in a same process as upon forming source and drain regions for an NMOS transistor to be formed together with an NPN transistor on a same silicon substrate, it is possible to omit a diffusion process exclusive for forming a high concentration region and hence to manufacture a semiconductor device through a reduced number of processes.

REFERENCES:
patent: 58-051556 (1983-03-01), None
patent: 63-72148 (1988-04-01), None
patent: 02-260641 (1990-10-01), None
patent: 5-206153 (1993-08-01), None
patent: 05-206153 (1993-08-01), None
patent: 2001-291781 (2001-10-01), None
Chinese Office Action issued in corresponding Chinese patent application No. 03108287.4, mailed Apr. 6, 2007 along with an English translation.

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