Bipolar transistor and manufacturing method

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257350, 257565, 437 31, H01L 2976, H01L 21265

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active

055875998

ABSTRACT:
Bipolar transistor, potentially with monolithically integrated MOSFETs, in the body silicon layer having a thickness of approximately 0.6 .mu.m in a SOI substrate, have a collector region and a base region that are produced by implantation. An oxide layer provided for the gate oxide of the MOSFETs is applied surface-wide and is partially removed in the region of the bipolar transistor, a polysilicon layer (5) also employed for the gate electrodes of the MOSFETs is applied and structured. Implantation for highly doped termination regions (5, 10, 12) for emitter, base and collector ensue with masks (13). An emitter region (8) is driven out of the highly doped polysilicon layer as terminal region for the emitter in a temperature step. The doping degree of the collector region, as lowest doped region, can be selected so light that the collector region is completely depleted. The function corresponds to a vertical bipolar transistor with a lateral collector space-charged zone.

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