Bipolar transistor and fabricating method thereof

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Mesa or stacked emitter

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S365000, C257S586000

Reexamination Certificate

active

07465638

ABSTRACT:
There is provided a bipolar transistor (with a respective fabrication method) that provides superior noise characteristics and gain diffusion. The fabricating method includes forming a first base region at a collector region, which in turn is formed on a substrate. A first silicon layer is formed on the base region, and a second silicon layer is formed on the first silicon layer using a forming method different from the method used in forming the first silicon layer. An emitter region is then formed from impurities at the base region by performing a thermal process.

REFERENCES:
patent: 5480815 (1996-01-01), Watanabe
patent: 5885880 (1999-03-01), Gomi
patent: 6905934 (2005-06-01), Hashimoto et al.
patent: 06-232147 (1994-08-01), None
patent: 09-195512 (1997-07-01), None
patent: 1998-074222 (1998-11-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Bipolar transistor and fabricating method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bipolar transistor and fabricating method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bipolar transistor and fabricating method thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4020310

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.