Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Mesa or stacked emitter
Reexamination Certificate
2006-08-01
2006-08-01
Smoot, Stephen W. (Department: 2813)
Semiconductor device manufacturing: process
Forming bipolar transistor by formation or alteration of...
Mesa or stacked emitter
C438S488000, C438S494000
Reexamination Certificate
active
07084041
ABSTRACT:
A method of manufacturing a bipolar device including pre-treatment using germane gas and a bipolar device manufactured by the same. The method includes forming a single crystalline silicon layer for a base region on a collector region; and forming a polysilicon layer for an emitter region thereon. Here, before the polysilicon layer is formed, the single crystalline silicon layer is pre-treated using germane gas. Thus, an oxide layer is removed from the single crystalline silicon layer, and a germanium layer is formed on the single crystalline silicon layer, thus preventing Si-rearrangement.
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Lee Ho
Lee Seung-hwan
Lim Byou-ree
Rhee Hwa-sung
Yoo Jae-yoon
Mills & Onello LLP
Samsung Electronics Co,. Ltd.
Smoot Stephen W.
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