Bilayer resist and process for preparing same

Details Bilayer resist and process for preparing same Bilayer resist and process for preparing same

1992-08-21

1994-03-01

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156655, 1566611, 156668, 156904, B44C 122, B29C 3700

Patent

active

052903974

ABSTRACT:
A resist pattern on a substrate is formed using an imageable resist layer on the surface of a substrate. The imageable resist layer comprises a silicon-incorporated polystyrene-diene block copolymer having a silicon weight percent of at least about 5 percent. The imageable layer is prepared by reacting a polystyrene-diene block copolymer with a silicon-containing compound in the presence of a platinum catalyst. In a preferred embodiment, the poly(styrene)-diene block copolymers are hydrosilylated by hydrosiloxanes using a platinum-divinyl tetramethyl disiloxane catalyst.

REFERENCES:
patent: 4061799 (1977-12-01), Brewer
patent: 4481049 (1984-11-01), Reichmanis et al.
patent: 4481279 (1984-11-01), Naito et al.
patent: 4504629 (1985-03-01), Lien et al.
patent: 4867838 (1989-09-01), Brooks et al.
patent: 4968552 (1990-11-01), Linde
K. Ito et al., Chem. Abstr. 90:138863y (1978).
Loctite Corp. Japanese Patent 62,179,506, Chem. Abstr. 108:205255g (1987).
L. Khananashvili et al., Chem. Abstr. 104:150506a (1985).
X. Guo et al., Macromolecules 23, 5047 (1990).
X. Guo et al., Macromolecules 25, 883 (1992).
M. Jurek, Lithographic Evaluation of Phenolic Resin-Siloxane Block Co-Polymers (1989).
M. Bowden, et al., Macromol. Symp. 53, 123-137 (1992).

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