Bilayer photolithographic process

Details Bilayer photolithographic process Bilayer photolithographic process

1993-03-05

1994-06-14

Rodee, Christopher

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430316, 430323, 430324, 430313, 156643, G03F 740

Patent

active

053209346

ABSTRACT:
In a process for creating a mask on the surface of an integrated circuit workpiece, a first layer of resist is applied to the surface of the workpiece. An upper portion of this first layer is metallized. A second layer of photoresist is applied to the first layer. The second layer of photoresist is selectively exposed and developed. Using the developed second layer as a mask, exposed respective areas of the metallized upper portion of the first layer are etched, and the non-metallized portions of the first layer are subsequently etched. The result is a metallized mask on the surface of the workpiece that avoids the problems of high topographical relief and irradiation reflections from the workpiece surface.

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