Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate
2005-09-13
2005-09-13
Nguyen, Tuan H. (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Having insulated electrode
C257S378000
Reexamination Certificate
active
06943413
ABSTRACT:
The invention concerns a BI-CMOS process, in which Field-Effect Transistors (FETs) and Bipolar Junction Transistors (BJTs) are manufactured on a common substrate. In several processing steps, FET structures are formed simultaneously with BJT structures. For example, in one step, polysilicon gate electrodes for the FETs and polysilicon emitters for the BJTs are formed simultaneously. In another aspect of the invention, a polysilicon layer is used to reduce channeling which would otherwise occur during an implant step.
REFERENCES:
patent: 4800171 (1989-01-01), Iranmanesh et al.
patent: 4818720 (1989-04-01), Iwasaki
patent: 4868135 (1989-09-01), Ogura et al.
patent: 4897703 (1990-01-01), Spratt et al.
patent: 4929570 (1990-05-01), Howell
patent: 4960726 (1990-10-01), Lechaton et al.
patent: 4965216 (1990-10-01), Scovell et al.
patent: 5001081 (1991-03-01), Tuntasood et al.
patent: 5006476 (1991-04-01), De Jong et al.
patent: 5047357 (1991-09-01), Eklund
patent: 5059549 (1991-10-01), Furuhata
patent: 5082796 (1992-01-01), El-Diwany et al.
patent: 5100811 (1992-03-01), Winnerl et al.
patent: 5132234 (1992-07-01), Kim et al.
patent: 5179036 (1993-01-01), Matsumoto
patent: 5183777 (1993-02-01), Doki et al.
patent: 5196356 (1993-03-01), Won et al.
patent: 5516718 (1996-05-01), Lee
patent: 5661046 (1997-08-01), Ilderem et al.
patent: 6124180 (2000-09-01), Chambers et al.
patent: 6249030 (2001-06-01), Lee
Havemann, Robert H., et al.; Process Integration Issues for Submicron BiCMOS Technology;Solid State Technology; Jun. 1992; pp. 71-76.
Ikeda, Takahide, et al.; High-Speed BiCMOS Technology with a Buried Twin Well Structure;IEEE Transactions on Electron Devices; Jun. 1987; pp. 1304-1310; vol. ED 34, No. 6.
Kubo, Masaharu, et al.; Perspective on BiCMOS VLSI's;IEEE Journal of Solid-State Circuits; Feb. 1988; pp. 5-11; vol. 23, No. 1.
Lage, Craig; BiCMOS Memories: Increasing Speed While Minimizing Process Complexity;Solid State Technology; Aug. 1992; pp. 31-34.
Shank, Patricia, et al.; An introduction of Microelectronics Manufacturing and Markets; seimiconductor-course; http://http@csberkeley.edu/-tokuyasu/hip-course/course.html; printed Apr. 18, 1997.
Wolf, Stanley, et al.; Silicon Processing for the VLSI Era, vol. 1: Process Technology; 1990; pp. 145-147 and 198; Lattice Press, Sunset Beach, California.
Wolf, Stanley, et al.; Silicon Processing for the VLSI Era, vo2. 1: Process Integration; 1990; pp. 65; Lattice Press, Sunset Beach, California.
Hynix / Semiconductor Inc.
Nguyen Tuan H.
Townsend and Townsend / and Crew LLP
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