Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1986-06-06
1989-08-08
James, Andrew J.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
357 47, 357 49, 357 69, 357 71, 156656, H01L 2948, H01L 2348, H01L 2702
Patent
active
048557960
ABSTRACT:
A beam lead diode configuration is described, employing a planar proton bombarded conversion region and a low-permittivity dielectric separator. The diode enjoys the mechanical ruggedness of the conventional planar diodes and the electrical performance of conventional mesa-type diodes. The diode structure results in the absence of N-type mesa structures on the substrate, allowing fabrication by relatively low-cost, high-yield photolithographic processes.
REFERENCES:
patent: 3836988 (1974-09-01), Board
patent: 4301233 (1981-11-01), Calviello
patent: 4499656 (1985-02-01), Fabian et al.
patent: 4577213 (1986-03-01), Bauhahn
Anderson et al., "GaAs Beam Lead Antiparallel Diodes for mm Wave Subharmonic Mixers", pp. 688-691, IEDM 81.
Kung Jen K.
Wen Cheng P.
Wong Wah S.
Gudmestad Terje
Hughes Aircraft Company
James Andrew J.
Meltzer Mark
Ngo Ngan V.
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