Baths and process for chemical polishing of copper or copper all

Details Baths and process for chemical polishing of copper or copper all Baths and process for chemical polishing of copper or copper all

1990-10-24

1992-03-24

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156651, 156903, 252 792, 252 794, B44C 122, C23F 100

Patent

active

050985175

ABSTRACT:
Baths for chemical polishing of copper or copper alloy surfaces, comprising, in aqueous solution, hydrogen peroxide, phosphoric acid and tetraborate ions.

REFERENCES:
patent: 3345225 (1967-10-01), Lacal
Japanese Patent Gazette; Derwent Publ. Ltd. Section Chemical Semaine X09; Res. No. 15396X/09; 4-7-76.
Electroplating, 10/1953; pp. 360-367, "Theory and Practice of Chemical Polishing".
Tegart et al., "Electrolytic and Chemical Polishing of Metals", Chapters 10 and 11, pp. 122-137 (1960), and English translation thereof.

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