Batch fabrication procedure for manufacture of arrays of field e

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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29569L, 29580, 156644, 156646, 156652, 156655, 313309, 313311, 357 30, 357 55, 427 77, 250396R, 445 51, 445 58, B44C 122, H01L 21306, C23F 102, B05D 512

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active

044989520

ABSTRACT:
A semiconductor type batch fabrication procedure is disclosed in the preferred and illustrated embodiment. The process forms individual field emission devices and the necessary electron optics for each. The optics, having the form of various anodes, is aligned on a common axis above a pyramid or conic member terminating at a tip which functions as a microgun with the anodes. The microgun structure is supported on a substrate and forms, modulates, deflects and focuses electron beams. The complete device utilizes voltage levels routinely obtained in conventional integrated circuits, which integrated circuits may be simultaneously fabricated on the same supportive substrate with the microguns. The procedure further contemplates the fabrication of a complete array of microguns arranged in rows and columns.

REFERENCES:
patent: 3998678 (1976-12-01), Fukase et al.
patent: 4291068 (1981-09-01), Jones et al.

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