Base metal composite electrical contact material

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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75228, 29875, 156630, 156634, 156643, 156646, 156664, 156667, 2041291, 204192E, 428553, C23F 102, B44C 122, C03C 1500, C03C 2506

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active

044759835

ABSTRACT:
A composite contact material for light-duty electrical contacts is formed by combining, typically by powder-metallurgical techniques, a matrix metal and particles of a conductive material that is typically harder and more corrosion resistant than the matrix metal, and by removing, in a differential material removal step, some of the matrix metal from a surface of the composite, thereby producing a "sandpaper" surface with a substantial number of the particles projecting by a substantial amount above the matrix metal surface. Typical matrix metals are copper, copper alloys, or nickel, and typical particle materials are metals such as Ru, Re, Os, and intermetallics, oxides, borides, nitrides, carbides, silicides, and phosphides of such metals as Al, Ti, Ni, Nb, Mo, Ru, Ta, W, Re, or Os. Particle size is typically between about 0.1 .mu.m and 100 .mu.m, preferably less than 10 .mu.m, and the particle volume fraction is typically between about 1% and 50%, preferably between 5% and 30%. Any appropriate differential material removal method, including chemical, plasma, sputter, thermal, and electrolytic etching, can be used.

REFERENCES:
patent: 2504906 (1950-04-01), Tremblay
patent: 3778257 (1973-12-01), Davies
patent: 3841869 (1974-10-01), Davies
patent: 3920452 (1975-11-01), Davies
Electrocomponent Science and Technology, vol. 2, 1976, pp. 259-261, Silver-Ruthenium Dioxide Contacts by D. J. Pedder.

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