Barrier removal at low polish pressure

Abrading – Abrading process – Glass or stone abrading

Reexamination Certificate

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Details

C451S057000, C451S060000, C451S287000, C451S288000, C451S447000, C438S627000, C438S626000, C438S633000, C438S643000, C438S645000

Reexamination Certificate

active

07104869

ABSTRACT:
The invention generally provides methods and compositions for planarizing a substrate surface having underlying dielectric materials. Aspects of the invention provide compositions and methods using a combination of low polishing pressures, polishing compositions, various polishing speeds, selective polishing pads, and selective polishing temperatures, for removing barrier materials by a chemical mechanical polishing technique with minimal residues and minimal seam damage. Aspects of the invention are achieved by employing a strategic multi-step process including sequential CMP at low polishing pressure to remove the deposited barrier materials.

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