Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1998-04-08
1999-08-10
Bowers, Charles
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438612, 438613, H01L 2144
Patent
active
059373202
ABSTRACT:
The present invention provides a means of fabricating a reliable C4 flip-chip structure for low-temperature joining. The electrochemically fabricated C4 interconnection has a barrier layer between the electroplated tin-rich solder bump and the ball-limiting metallurgy that protects the terminal metal in the ball-limiting metallurgy from attack by the Sn in the solder. The barrier layer is electroplated through the same photoresist mask as the solder and thus does not require a separate patterning step. A thin layer of electroplated nickel serves as a reliable barrier layer between a copper-based ball-limiting metallurgy and a tin-lead (Sn--Pb) eutectic C4 ball.
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Jean Audet, et al., "Low Cost Bumping Process for Flip Chip", Proc. 1995 International Flip Chip, BGA, and Ado Pkg. Symposium ITAP 95, '95 Flip Chip, BGA, TAB & AP Symposium, pp. 16-21 (1995).
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J.D. Mis, et al., "Flip Chip Production Experience: Some Design, Process, Reliability, and Cost Considerations", ISHM '96 Proceedings, Proc. 1996 International Symposium on Microelectronics SPIE vol. 2920, pp. 291-295 (1996).
S.K. Kang, et al., "Interfacial Reactions During Soldering With Lead-Tin Eutectic and Lead (Pb)-Free, Tin-Rich Solders", Journal of Electronic Materials, vol. 25, No. 7, pp. 1113-1120 (1996).
Eric Jung, et al., "The Influence of NiSn Intermetallics on the Performance of Flip Chip Contacts Using a Low Cost Electroless Nickel Bumping Approach", IEPS Proceedings of the Technical Conference, 1996 Electronics Packaging Conference, Austin, Texas, pp. 14-25 (Sep. 29-Oct. 1, 1996).
Andricacos Panayotis Constantinou
Datta Madhav
Horkans Wilma Jean
Kang Sung Kwon
Kwietniak Keith Thomas
Bowers Charles
International Business Machines - Corporation
Sulsky Martin
Trepp Robert M.
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