Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...
Reexamination Certificate
2007-11-06
2007-11-06
Sarkar, Asok K. (Department: 2891)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
C438S761000, C438S762000, C438S766000, C438S770000, C438S771000, C438S768000, C257S360000, C257SE21589
Reexamination Certificate
active
10550215
ABSTRACT:
In order to mitigate erosion of exposed processing elements in a processing system by the process and any subsequent contamination of the substrate in the processing system, processing elements exposed to the process are coated with a protective barrier. The protective barrier comprises a protective layer that is resistant to erosion by the plasma, and a bonding layer that improves the adhesion of the protective layer to the processing element to mitigate possible process contamination by failure of the protective layer.
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Allen Mark A.
Escher Gary
Sarkar Asok K.
Tokyo Electron Limited
Yevsikov Victor V.
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