Barrier film material and pattern formation method using the...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

Reexamination Certificate

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C430S961000

Reexamination Certificate

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07871759

ABSTRACT:
A resist film is formed on a substrate, and a barrier film including a compound whose alkali-insoluble property is changed to an alkali-soluble property through molecular structure change caused by an alkaline solution is formed on the resist film. Thereafter, with an immersion liquid provided on the barrier film, pattern exposure is performed by selectively irradiating the resist film through the barrier film with exposing light. After the pattern exposure, the barrier film is removed and the resist film is developed. Thus, a resist pattern made of the resist film is formed.

REFERENCES:
patent: 2006/0105272 (2006-05-01), Gallagher et al.
Switkes et al. “Immersion lithography at 157 nm”, J. Vac. Sci. Technol. vol. 19(6), Nov./Dec. 2001, pp. 2353-2356.
Smith et al. “Approaching the numerical aperture of water—Immersion lithography at 193 nm”, Optical Microlithography XVII, Proceedings of SPIE vol. 5377, pp. 273-284, 2004.

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