Metal fusion bonding – Process – Plural joints
Patent
1990-10-15
1991-12-31
Seidel, Richard K.
Metal fusion bonding
Process
Plural joints
228 447, B23K 3102
Patent
active
050764861
ABSTRACT:
An aluminum foil has, sputtered upon it, a foil of tungsten, upon which a foil of gold is sputter deposited. The gold foil may be placed next to a gold substrate, and the three-foil combination bonded to the substrate with a stylus, upon which ultrasound is impressed, in the presence of a moderately elevated temperature. An aluminum region the size of the tip of the stylus is thus made available for an aluminum wire to be bonded to it, without any direct contact between the aluminum wire and the gold substrate.
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Redmond Patrick J.
Slemmons John W.
Woolston Francis J.
Hamann Fredrick
Mah Chuck Y.
Montanye George A.
Rockwell International Corporation
Seidel Richard K.
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