Ball transferring method and apparatus

Details Ball transferring method and apparatus Ball transferring method and apparatus

2005-07-12

2005-07-12

Nguyen, Ha Tran (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S615000, C438S616000

Reexamination Certificate

active

06916731

ABSTRACT:
Balls are sucked onto a carrier board so as to be temporarily arranged in a ball arrangement region of the board, and then the balls are transferred and bonded onto an objective substance with their positions being adjusted. Gas blow is applied to the temporarily arranged balls or alternatively the temporarily arranged balls are sucked, so as to remove excess balls other than balls that have been exactly sucked onto the ball arrangement region. Cooperation with application of fine vibration to the carrier board makes the removal of the excess balls more efficient.

REFERENCES:
patent: 5431332 (1995-07-01), Kirby et al.
patent: 5657528 (1997-08-01), Sakemi et al.
patent: 5687901 (1997-11-01), Hoshiba et al.
patent: 7-153765 (1995-06-01), None
patent: 8-112671 (1996-05-01), None
patent: 11111767 (1999-04-01), None
patent: 2000-12593 (2000-01-01), None
patent: 2000232132 (2000-08-01), None

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