Ball limiting metal mask and tin enrichment of high melting poin

Details Ball limiting metal mask and tin enrichment of high melting poin Ball limiting metal mask and tin enrichment of high melting poin

1997-04-10

1999-09-14

Brown, Peter Toby

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438613, 438106, 438108, H01L 2144

Patent

active

059536233

ABSTRACT:
A solder interconnection uses preferably lead-rich balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate. After a solder ball has been formed using standard processes, a ball limiting metal mask is formed using photoresist. A thin cap layer of preferably pure tin is deposited on a surface of the solder balls using a tin aqueous immersion process.

REFERENCES:
patent: 2964839 (1960-12-01), Marafioti et al.
patent: 5026624 (1991-06-01), Day et al.
patent: 5027188 (1991-06-01), Owada et al.
patent: 5060844 (1991-10-01), Behun et al.
patent: 5075965 (1991-12-01), Carey et al.
patent: 5264325 (1993-11-01), Allen et al.
patent: 5278010 (1994-01-01), Day et al.
patent: 5300402 (1994-04-01), Card et al.
patent: 5316788 (1994-05-01), Dibble et al.
patent: 5324569 (1994-06-01), Nagesh et al.
patent: 5341564 (1994-08-01), Akhavain et al.
patent: 5376584 (1994-12-01), Agarwala
patent: 5384283 (1995-01-01), Gegenwarth et al.
patent: 5473814 (1995-12-01), White
patent: 5668059 (1997-09-01), Christie et al.
patent: 5777391 (1998-07-01), Nakamura et al.
patent: 5838069 (1998-11-01), Itai et al.
E.J. Armstrong, "Dendrite Connector System with Reinforced Base", IBM Technical Disclosure Bulletin, vol. 23, No. 8, p. 3631, Jan. 1981.
C.H. Crockett et al., "UV Image Reworkable Encapsulent for Fatigue Life Enhancement", IBM Technical Disclosure Bulletin, vol. 37, No. 5, p. 127, May 1994.
Shipley, "Tinposit LT-26" Operating Manual, .COPYRGT.1987, (8) pages.
Shipley, "Tinposit LT-34" Operating Manual, .COPYRGT.1984, (4) pages.
G.J. Gaudenzi et al., "Socketed Package for Surface Mount Applications", IBM Technical Disclosure Bulletin, vol. 36, No. 12, pp. 325-326, Dec. 1993 .

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