Ball grid array with heat sink

Details Ball grid array with heat sink Ball grid array with heat sink

1995-09-11

1997-01-28

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 802, 165185, 257707, 257713, 257796, 361718, H05K 720

Patent

active

055983219

ABSTRACT:
A ball grid array (BGA) package incorporating a heat sink member which includes a first portion mounted between an integrated circuit chip (die) and a package substrate, a second portion exposed on a surface of a molded plastic cover formed over the die and package substrate, and thermal conductors connected between the first portion and the second portion. Heat generated by the die is transmitted by the thermal conductors from the first portion to the second portion, and is dissipated outside of the BGA package.

REFERENCES:
patent: 5041902 (1991-08-01), McShane
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5365107 (1994-11-01), Kuraishi et al.

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