Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-05-05
2000-12-12
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361690, 361719, 361761, 361764, 361774, 257700, 257712, 257737, 257706, 257675, 174252, 174255, H05K 720
Patent
active
061607053
ABSTRACT:
A structure (10) is provided that is fabricated as a ball grid array substrate that includes a substrate dielectric (14), a power ring (18), a ground ring (20), a plurality of traces, and a second metal layer (16). The substrate dielectric (14) includes a first side, a second side, and a cavity formed therein. The power ring (18), the ground ring (20), and the plurality of traces are provided on the first side of the substrate dielectric (14). The plurality of traces, for example, may include a signal connection (22), a ground connection (24), and a power connection (26). The second metal layer (16) is provided on the second side of the substrate dielectric (14) and is electrically coupled to the first side. For example, the second metal layer (16) may serve as an active ground plane and electrically couple to a variety of ground connections, such as the ground connection (24), and the ground ring (20) through vias in the substrate dielectric (14). The present invention also provides a method for forming a ball grid array package using the structure (10).
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Hassanzadeh Nozar
Stearns William P.
Brady III Wade James
Chervinsky Boris L.
Picard Leo P.
Telecky Jr. Frederick J.
Texas Instruments Incorporated
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