Ball grid array-integrated circuit testing device

Details Ball grid array-integrated circuit testing device Ball grid array-integrated circuit testing device

1998-04-30

2002-04-16

Nguyen, Vinh P. (Department: 2858)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S755090, C324S765010

Reexamination Certificate

active

06373267

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a measuring mechanism for an assembled or a packaged BGA (Ball Grid Array)-IC, particularly to a measuring mechanism for measuring a packaged BGA-IC and the package of the BGA-IC capable of facilitating and assuring contact between a soldering ball and a contact seat for a BGA, and of shortening measuring time when the package of the BGA-IC and packaged BGA-IC are measured. The measurement of both the packaged BGA-IC and the package of the BGA-IC is hereinafter defined as the measurement of the BGA-IC.
2. Prior Art
In the conventional technique, a measuring mechanism for testing or measuring a BGA-IC has an arrangement, for example, as shown in FIG.
4
(A) and
4
(B).
In these figures, the measuring mechanism comprises, a substrate
60
composed of a contact seat
61
for contacting a soldering ball
71
of a BGA-IC
70
(hereinafter referred to as BGA contact seat
61
), signal connection patterns
62
and
64
, a signal connection through hole
63
, and a measuring contact seat
65
for connecting to a tester, not shown.
The BGA contact seat
61
is formed on the substrate
60
and it is circular and flat.
The BGA contact seat
61
is connected to the measuring contact seat
65
, which is positioned at the tester side and opposite to the BGA contact seat
61
, through the signal connection pattern
62
, the signal connection through hole
63
and the signal connection pattern
64
. The measuring contact seat
65
is connected to a circuit such as a pin electronic circuit at the tester side.
With such an arrangement, when the BGA-IC
70
is tested, the soldering ball
71
of the BGA-IC
70
is forced to contact the BGA contact seat
61
so that the assembled BGA-IC
70
can be tested in its electric characteristics.
However, in the conventional measuring mechanism for a BGA-IC, the surface of the BGA contact seat
61
formed on the substrate
60
is flat. On the other hand, the surface of the soldering ball
71
of the BGA-IC
70
is spherical. Accordingly, the soldering ball
71
and the BGA contact seat
61
contact each other at a point, namely, they contact each other in a point contact mode (FIG.
4
(B)).
That is, as shown in FIG.
4
(B), the soldering ball
71
contacts the BGA contact seat
61
at a point
71
A.
Accordingly, if a foreign matter
80
is sandwiched between the soldering ball
71
and the BGA contact seat
61
as shown in
FIG. 5
, the BGA contact seat
61
and the soldering ball
71
do not normally contact each other, so that inferior contact occurs, which makes it difficult to measure the BGA-IC
70
.
That is, since the soldering ball
71
contact the BGA contact seat
61
at the point
71
A alone (FIG.
4
(B)), it can not contact the BGA contact seat
61
in other portions if the foreign matter
80
is sandwiched between the soldering ball
71
and the BGA contact seat
61
, which makes them inferior in contact.
SUMMARY OF THE INVENTION
It is an object of the invention to provide a measuring mechanism for a BGA-IC capable of assuring and facilitating the contact between a soldering ball of a BGA-IC and a BGA contact seat even if a foreign matter is sandwiched therebetween, and also capable of saving time involved in checking of the recontact therebetween, thereby shortening measuring time.
To achieve the above object, the invention comprises a substrate
30
including a BGA contact seat
10
which is embedded therein and has a conical contact surface
10
A, and is connected to a tester, and a BGA-IC
40
having a soldering ball
41
wherein the soldering ball
41
contacts the conical contact surface
10
A of the BGA contact seat
10
when the BGA-IC
40
is tested.
With such an arrangement, since the conical contact surface
10
A of the BGA contact seat
10
is conical (
FIGS. 1
,
2
and
3
), the entire outer periphery
41
A of the soldering ball
41
of the BGA-IC
40
can contact the BGA contact seat
10
so that they can contact each other in a line contact mode, and hence even if a foreign matter
50
is sandwiched between the soldering ball
41
and the BGA contact seat
10
, they can contact each other at the other portions other than the portion where the foreign matter
50
is sandwiched therebetween.
Further, since the contact between the soldering ball
41
and the BGA contact seat
10
can be facilitated and assured compared in the point contact mode at the point
71
A as explained with reference to
FIGS. 4 and 5
, it is not necessary to check the recontact therebetween, and hence measuring time can be shortened by the time involved in checking the recontact therebetween.
That is, since the conical contact surface
10
A of the BGA contact seat
10
is conical, the conical contact surface
10
A can contact the BGA-IC
40
at any part of the conical contact surface
10
A even if the foreign matter
50
is sandwiched between the soldering ball
41
and the BGA contact seat
10
, and hence the contact therebetween can be facilitated and assured, thereby saving time involved in checking the recontact therebetween to shorten the measuring time.


REFERENCES:
patent: 5585162 (1996-12-01), Schueller
patent: 5691041 (1997-11-01), Frankeny et al.
patent: 5702255 (1997-12-01), Murphy et al.
patent: 5730606 (1998-03-01), Sinclair
patent: 5931685 (1999-08-01), Hembree et al.
patent: 5932891 (1999-08-01), Higashi et al.
patent: 5952840 (1999-09-01), Farnworth et al.
patent: 5962921 (1999-10-01), Farnworth et al.

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