Ball contact for flip-chip devices

Details Ball contact for flip-chip devices Ball contact for flip-chip devices

1995-08-04

1998-12-15

Lorin, Francis J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29885, B05D 312

Patent

active

058491325

ABSTRACT:
A contact for a semiconductor device or passive substrate is made up of an array of conductive balls, the individual balls of the contact being a compressible material coated with a metal conductive material. The balls in the array are compressed while being bonded to the contact area to provide a larger bond area between the ball and the contact area to which it is bonded.

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