Baking of photoresist on wafers

Electric heating – Heating devices – Combined with container – enclosure – or support for material...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

392416, 118724, 118725, F27B 514

Patent

active

061370886

ABSTRACT:
A method and apparatus for curing a photoresist that is deposited in liquid form and spun on a surface of a wafer leaving a thin film to be cured. This invention teaches methods for curing the resist with improved thickness control using front side heating.

REFERENCES:
patent: 4814243 (1989-03-01), Ziger
patent: 4988284 (1991-01-01), Liu et al.
patent: 5194401 (1993-03-01), Adams et al.
patent: 5306653 (1994-04-01), Hur
patent: 5431700 (1995-07-01), Sloan
patent: 5498292 (1996-03-01), Ozaki
patent: 5870526 (1999-02-01), Aschner et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Baking of photoresist on wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Baking of photoresist on wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Baking of photoresist on wafers will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1966058

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.