Bake apparatus for use in spin-coating equipment

Details Bake apparatus for use in spin-coating equipment Bake apparatus for use in spin-coating equipment

2005-04-01

2009-02-17

Fuqua, Shawntina (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C219S405000, C219S411000, C219S444100, C392S386000, C392S388000, C392S416000, C392S418000, C118S715000, C118S7230VE, C118S724000, C118S725000, C118S728000, C118S729000, C118S733000

Reexamination Certificate

active

07491913

ABSTRACT:
Bake apparatus for use in baking a substrate, such as a semiconductor wafer, includes a chamber, a hot plate installed within the chamber, and first and second buffer plates for uniformly dispersing hot gas. The hot plate is configured to support the semiconductor wafer. The gas is injected into the chamber through an air passageway and is exhausted through an air exhaust opening. The first buffer plate is disposed within an upper part of the chamber so as to uniformly disperse the gas within the chamber. The second buffer plate is disposed above the first buffer plate. The first and second buffer plates each have a number of discharge holes by which the gas is uniformly discharged from the chamber to the exhaust opening.

REFERENCES:
patent: 5916631 (1999-06-01), Mahneke
patent: 6185370 (2001-02-01), Sekimoto et al.
patent: 2002/0098283 (2002-07-01), Gurer et al.
patent: 2005/0003600 (2005-01-01), Kasai et al.

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