Baffle plate design for decreasing conductance lost during preci

Details Baffle plate design for decreasing conductance lost during preci Baffle plate design for decreasing conductance lost during preci

1998-02-26

2000-07-25

Nuzzolillo, Maria

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118723E, 118723I, 118723MW, 118715, 20429807, C23C 1600

Patent

active

060932813

ABSTRACT:
A baffle plate for semiconductor processing apparatus. The baffle plate includes a plurality of slits. A plurality of fins are located between adjacent slits. The fins have varying heights and a supporting portion interconnects the fins.

REFERENCES:
patent: 3296115 (1967-01-01), Laegreid et al.
patent: 4369730 (1983-01-01), Izu et al.
patent: 4798165 (1989-01-01), deBoer et al.
patent: 4986216 (1991-01-01), Ohmori et al.
patent: 5292396 (1994-03-01), Takashima et al.
patent: 5516367 (1996-05-01), Lei et al.

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