Backside illuminated imaging sensor with silicide light...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S233000, C257S291000, C257S433000, C257SE27130, C257SE27133, C257SE25032, C438S048000, C438S072000, C438S073000

Reexamination Certificate

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07989859

ABSTRACT:
A backside illuminated imaging sensor includes a semiconductor layer, a metal interconnect layer and a silicide light reflecting layer. The semiconductor layer has a front surface and a back surface. An imaging pixel that includes a photodiode region is formed within the semiconductor layer. The metal interconnect layer is electrically coupled to the photodiode region and the silicide light reflecting layer is coupled between the metal interconnect layer and the front surface of the semiconductor layer. In operation, the photodiode region receives light from the back surface of the semiconductor layer, where a portion of the received light propagates through the photodiode region to the silicide light reflecting layer. The silicide light reflecting layer is configured to reflect the portion of light received from the photodiode region.

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PCT/US2008/088333, PCT International Search Report and Written Opinion of the International Searching Authority, mailed Mar. 19, 2009, 9 pages.

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