Backgated FinFET having different oxide thicknesses

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257SE29264, C257SE29275

Reexamination Certificate

active

11365504

ABSTRACT:
A method of producing a backgated FinFET having different dielectric layer thickness on the front and back gate sides includes steps of introducing impurities into at least one side of a fin of a FinFET to enable formation of dielectric layers with different thicknesses. The impurity, which may be introduced by implantation, either enhances or retards dielectric formation.

REFERENCES:
patent: 6433609 (2002-08-01), Voldman
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patent: 6593192 (2003-07-01), Zahurak et al.
patent: 6611023 (2003-08-01), En et al.
patent: 6885055 (2005-04-01), Lee
patent: 2002/0105039 (2002-08-01), Hanafi et al.
patent: 2003/0193070 (2003-10-01), Chan et al.
patent: 2003/0209761 (2003-11-01), Yagishita et al.
patent: 2004/0075122 (2004-04-01), Lin et al.
patent: 2003-110109 (2003-04-01), None

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