Backend metallization method and device obtained therefrom

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

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C257S635000, C257S637000, C257S640000, C257S758000, C257S773000, C438S618000, C438S629000

Reexamination Certificate

active

06858937

ABSTRACT:
A semiconductor device and a method of making it are described. During the formation of the semiconductor device, a hard mask is formed of an etch-resistant material. The mask prevents etchant from etching an area within a dielectric material near a conductive plug. The mask may be formed of a nitride. Conductive material is then deposited withinan etched via and is contacted with the conductive plug.

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Peter Singer, “Dual-Damascene Challenges Dielectric Etch”, Semiconductor International, Aug. 1999, pp. 68-72.

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