Back side relief on thermal ink jet die assembly

Details Back side relief on thermal ink jet die assembly Back side relief on thermal ink jet die assembly

1995-01-30

1996-04-09

Echols, P. W.

Incremental printing of symbolic information

Ink jet

Ejector mechanism

B41J 314

Patent

active

055066100

ABSTRACT:
A method of dicing a printhead wafer containing a plurality of individual print elements into discreet elements. A back side relief feature is formed on the bottom front edge of a thermal ink jet print element from a heater side during a first dicing cut, followed by a second dicing cut from a channel side of the wafer to form a front face nozzle. The back cut feature enables front face maintenance by a wiper blade or other maintenance operation, provides a pocket for excess die bonding adhesive during manufacture, and reduces front face chipping during dicing caused by the saw blade contacting the die wafer mounting media and becoming contaminated. The relief feature may be a square step feature or a beveled back cut feature and may additionally be located on a top front edge of the print element.

REFERENCES:
patent: Re32572 (1988-01-01), Hawkins et al.
patent: 4638337 (1987-01-01), Torpey et al.
patent: 4774530 (1988-09-01), Hawkins
patent: 4878992 (1989-11-01), Campanelli
patent: 5057853 (1991-10-01), Fisher
patent: 5068006 (1991-11-01), Fisher

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