Automatic wafer etching method and apparatus

Details Automatic wafer etching method and apparatus Automatic wafer etching method and apparatus

1992-05-29

1993-09-21

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156645, 156662, 156345, H01L 21306, B44C 122

Patent

active

052465284

ABSTRACT:
An automatic wafer etching apparatus including a first elevator and a second elevator each having a top surface whose vertical cross-section is circularly concaved having a curvature equal to that of the wafers and adapted to reciprocate vertically such that the top surface can pass through the etching drum, and an etching drum having a main housing consisting of a pair of vertical parallel side plates opposing each other, a horizontal shaft integral with the main housing side plates; a plurality of rollers borne between the main housing side plates in a manner such that they are freely rotatory; the rollers having annular grooves in their surfaces to receive edges of wafers in a manner such that the wafers are supported vertically at suitable intervals in a horizontal row; small-diameter gears locked at those ends of the rollers.

REFERENCES:
patent: 4976815 (1990-12-01), Hiratsuka et al.

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