Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1994-09-21
1995-12-26
Heinrich, Samuel M.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
228 562, B05C 502, B23K 300, H05K 334
Patent
active
054780047
ABSTRACT:
An automatic soldering apparatus and method includes compressed air pipes on both sides of a ceramic foaming tube to prevent through holes of the ceramic foaming tube from being clogged by a foreign substance and to constantly maintain the air pressure within the ceramic foaming tube for uniform dimension of foaming flux and uniform foaming height, thereby performing uniform flux treatment upon a circuit board to eliminate inferiority caused by the foaming flux.
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patent: Re33899 (1992-04-01), Tyer
patent: 3218193 (1965-11-01), Isaacson
patent: 4039703 (1977-08-01), Kamijo et al.
patent: 4375371 (1983-03-01), Tsuchikura
patent: 4684544 (1987-08-01), Arnett
patent: 4796558 (1989-01-01), Chartrand et al.
patent: 4934307 (1990-06-01), Sumiyoshi
Heinrich Samuel M.
Samsung Electronics Co,. Ltd.
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