Automatic reflow soldering apparatus

Details Automatic reflow soldering apparatus Automatic reflow soldering apparatus

1992-07-30

1993-09-07

Heinrich, Samuel M.

Metal fusion bonding

With control means responsive to sensed condition

Work-responsive

228 43, 228212, 228214, B23K 1008

Patent

active

052420965

ABSTRACT:
An automatic reflow soldering apparatus for soldering a printed circuit board having a plurality of electronic elements mounted thereon to be soldered while the printed circuit is heated, wherein transporting means transports a carrier carrying the printed circuit board to be soldered, positioning means arranged on the carrier position the printed circuit board on the carrier and support means arranged on the carrier support the printed circuit board to prevent the latter from being warped when heated to be soldered. The printed circuit board is transported through all of the soldering processes from a heating process to a cooling process while the printed circuit board is thus positioned and supported. Further provided is means which is automatically operated to position and support the printed circuit board on the carrier.

REFERENCES:
patent: 4068792 (1978-01-01), Dixon
patent: 4076165 (1978-02-01), Latasiewicz
patent: 4390120 (1983-06-01), Broyer
patent: 4637541 (1987-01-01), Tanny
patent: 4654502 (1987-03-01), Furtek
patent: 4913334 (1990-04-01), Kondo

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