4. Metal fusion bonding
  5. With control means responsive to sensed condition
  6. Work-responsive

Masashi Tsunabuchi

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Automatic reflow soldering apparatus

Metal fusion bonding – With control means responsive to sensed condition – Work-responsive
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Size reduction of chip mounting system

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Size reduction of chip mounting system

Metal working – Means to assemble or disassemble – Means to assemble electrical device
Reexamination Certificate

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Profile ID: LFUS-PAI-P-710995

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