Automated wafer lapping system

Details Automated wafer lapping system Automated wafer lapping system

1996-05-31

1997-10-21

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

With indicating

451 41, 451285, 451286, 451287, 451288, 451289, B24B 3702

Patent

active

056790554

ABSTRACT:
An automated wafer lapping system including a robot which loads wafers from a cassette into a wafer carrier on a lapping machine one at a time and one after another. The robot is capable of delivering lapped wafers to a thickness gauging device for measuring the wafer thickness and recalibrating the lapping machine between each run. Openings in the wafer carriers for receiving wafers are sized closely to the wafer for minimal relative motion between the wafer and carrier. A centering jig and search program for the robot facilitate fast location of the wafers in the openings. The lapping system also inspects wafers for defects and sorts them accordingly after lapping.

REFERENCES:
patent: 4593495 (1986-06-01), Kawakami et al.
patent: 5081796 (1992-01-01), Schultz
patent: 5174067 (1992-12-01), Hasegawa et al.
patent: 5329732 (1994-07-01), Karlsrud et al.
patent: 5333413 (1994-08-01), Hashimoto

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