Automated stacking and soldering apparatus for three dimensional

Details Automated stacking and soldering apparatus for three dimensional Automated stacking and soldering apparatus for three dimensional

1998-02-05

2000-07-25

Mills, Gregory

Metal fusion bonding

Process

Plural joints

2281791, 228 443, B23K 3100

Patent

active

060927135

ABSTRACT:
An automated apparatus for three dimensional stack package devices provides mass production of J-lead type stack packages. The apparatus includes a package loader and a package loader/unloader for loading upper and lower individual packages and for unloading packages which have been stacked and soldered; an indexing system for receiving and aligning the upper and lower individual packages and for transporting the stacked upper and lower packages, an applying unit for applying a solder flux or a solder paste to metal leads of the upper individual packages, first and second transfer tools for transferring the individual packages to the applying unit and to the indexing system; and a heating unit for heating the stacked upper and lower packages so that metal leads of the upper and lower packages are solder jointed.

REFERENCES:
patent: 3094093 (1963-06-01), Zimmerman
patent: 5236117 (1993-08-01), Roane et al.
patent: 5963426 (1999-10-01), Hayden et al.

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