Optics: measuring and testing – Inspection of flaws or impurities – Surface condition
Reexamination Certificate
2007-03-20
2009-12-29
Toatley, Jr., Gregory J (Department: 2877)
Optics: measuring and testing
Inspection of flaws or impurities
Surface condition
C356S237200, C356S445000, C356S342000
Reexamination Certificate
active
07639351
ABSTRACT:
A fabrication cluster can be controlled using optical metrology. A fabrication process is performed on a wafer using a fabrication cluster. A photonic nanojet, an optical intensity pattern induced at a shadow-side surface of a dielectric microsphere, is generated. An inspection area on the wafer is scanned with the photonic nanojet. A measurement is obtained of the retroreflected light from the dielectric microsphere as the photonic nanojet scans the inspection area. The existence of a structure in the inspection area is determined with the obtained measurement of the retroreflected light. One or more process parameters of the fabrication cluster is adjusted based on the determination of the existence of the structure in the inspection area.
REFERENCES:
patent: 5926690 (1999-07-01), Toprac et al.
patent: 6304999 (2001-10-01), Toprac et al.
patent: 6383824 (2002-05-01), Lensing
patent: 6383888 (2002-05-01), Stirton
patent: 6433871 (2002-08-01), Lensing et al.
patent: 6451621 (2002-09-01), Rangarajan et al.
patent: 6597463 (2003-07-01), Singh et al.
patent: 6609086 (2003-08-01), Bao et al.
patent: 6625512 (2003-09-01), Goodwin
patent: 6633831 (2003-10-01), Nikoonahad et al.
patent: 6643557 (2003-11-01), Miller et al.
patent: 6657736 (2003-12-01), Finarov et al.
patent: 6701206 (2004-03-01), Markle et al.
patent: 6708075 (2004-03-01), Sonderman et al.
patent: 6756243 (2004-06-01), Pasadyn et al.
patent: 6782337 (2004-08-01), Wack et al.
patent: 6785638 (2004-08-01), Niu et al.
patent: 6791679 (2004-09-01), Engelhard et al.
patent: 6891626 (2005-05-01), Niu et al.
patent: 6895295 (2005-05-01), Grover et al.
patent: 6943900 (2005-09-01), Niu et al.
patent: 6999254 (2006-02-01), Phan et al.
patent: 7042569 (2006-05-01), Sezginer et al.
patent: 7043397 (2006-05-01), Johnson
patent: 7065423 (2006-06-01), Prager et al.
patent: 7072049 (2006-07-01), Niu et al.
patent: 7092110 (2006-08-01), Balasubramanian et al.
patent: 7126700 (2006-10-01), Bao et al.
patent: 7158896 (2007-01-01), Singh et al.
patent: 7171284 (2007-01-01), Vuong et al.
patent: 7186650 (2007-03-01), Dakshina-Murthy
patent: 7224456 (2007-05-01), Phan et al.
patent: 7224471 (2007-05-01), Bischoff et al.
patent: 7280230 (2007-10-01), Shchegrov et al.
patent: 2004/0017574 (2004-01-01), Vuong et al.
patent: 2004/0267397 (2004-12-01), Doddi et al.
patent: 2005/0209816 (2005-09-01), Vuong et al.
patent: 2007/0185684 (2007-08-01), Vuong et al.
patent: 2008/0007739 (2008-01-01), Vuong et al.
Owen, J. F. et al. (Nov. 1981). “Internal Electric Field Distributions of a Dielectric Cylinder at Resonance Wavelengths,”Optics Letters6(11):540-542.
Benincasa, D. S. et al. P. (Apr. 1987). “Spatial Distribution of the Internal and Near-Field Intensities of Large Cylindrical and Spherical Scatterers,”Applied Optics26(7):1348-1356.
Xu. Y. (Jul. 1995). “Electromagnetic Scattering by an Aggregate of Spheres,”Applied Optics34(21):4573-4588.
Adler, C. L. et al. (Jun. 1997). “High-Order Interior Caustics Produced in Scattering of a Diagonally Incident Plane Wave by a Circular Cylinder,”Journal of the Optical Society of America A14(6):1305-1315.
Lock, J. A. et al. (Oct. 2000). “Exterior Caustics Produced in Scattering of a Diagonally Incident Plane Wave by a Circular Cylinder: Semiclassical Scattering Theory Analysis,”Journal of the Optical Society of America A17(10):1846-1856.
Braun, A. E. (May 1, 2002). “Thin-Film Measurement Enters New Frontiers,”Semiconductor International, located at <http://www.semiconductor.net/articie/CA213802.html> visited on Jun. 12, 2008. (7 pages).
MacCormack, S. et al. (Feb. 15, 1997). “Powerful, Diffraction-Limited Semiconductor Laser Using Photorefractive Beam Coupling,”Optics Letters22(4):227-229.
Mcneil, J. R. (2000). “Scatterometry Applied to Microelectronics Processing,”IEEE, pp. 37-38.
Chen, Z. et al. (Apr. 5, 2004). “Photonic Nanojet Enhancement of Backscattering of Light by Nanoparticles: a Potential Novel Visible-Light Ultramicroscopy Technique,”Optics Express12(7):1214-1220.
Chen, Z. et al. (Jan. 15, 2006). “Superenhanced Backscattering of Light by Nanoparticles,”Optics Letters31(2):196-198.
May, G. S. et al. (2006).Fundamentals of Semiconductor Manufacturing and Process Control. John Wiley & Sons, Inc.: Hoboken, New Jersey, 13 pages.
U.S. Appl. No. 11/726,083, filed Mar. 20, 2007 for Chen et al.
Arthur, G. G. et al. (1997). “Enhancing the Development Rate Model for Optimum Simulation Capability in the Subhalf-Micron Regime,”Proceedings of SPIE3049:189-200.
Ausschnitt, C. P. (Feb. 23, 2004). “A New Approach to Pattern Metrology,”Proceedings of SPIE5375:51-65.
Haykin, S. (1999).Neural Networks. 2nd edition, M. Horton ed., Prentice Hall: Upper Saddle River, New Jersey, 9 pages (Table of Contents).
Keeman, V. (2005). “Support Vector Machine—An Introduction”In Support Vector Machines: Theory and Applications. Wang, L. ed., Springer-Verlag Berlin Heidelberg: The Netherlands, pp. 1-47.
Li, L. (1996). “Formulation and comparison of two recursive matrix algorithms for modeling layered diffraction gratings,”Journal of the Optical Society of America A13:1024-1035.
Platt, J. C. (1999). “Fast Training of Support Vector Machines Using Sequential Minimal Optimization” Chapter 12In Advances in Kernel Methods: Support Vector Learning. Schölkopf et al. eds., MIT Press: Cambridge, MA, pp. 185-208.
U.S. Appl. No. 11/371,752, filed Mar. 8, 2006 for Vuong et al.
U.S. Appl. No. 11/484,484, filed Jul. 10, 2006 for Madriaga et al.
U.S. Appl. No. 11/594,659, filed Nov. 7, 2006 for Vuong et al.
U.S. Appl. No. 11/729,700, filed Mar. 28, 2007 for Bischoff et al.
U.S. Appl. No. 11/787,025, filed Apr. 12, 2007 for Jin et al.
Chen Zhigang
Chu Hanyou
Li Shifang
Madriaga Manuel
Madriaga Manuel B.
Slomski Rebecca C
Toatley Jr. Gregory J
Tokyo Electron Limited
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