Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2005-02-18
2008-08-05
Whitmore, Stacy A (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C716S030000, C715S700000
Reexamination Certificate
active
07409666
ABSTRACT:
An automated PCB manufacturing documentation release package system including a PCB database including PCB CAD data associated with a CAD file of a PCB design, and a shape engine configured to display simultaneous views of a given PCB from the PCB database including different views of the PCB and configured to retrieve the data in the PCB database and create reconfigurable objects displayable simultaneously in the forms of different views of the PCB such that any change in the design of the PCB is reflected in the different views.
REFERENCES:
patent: 2003/0221172 (2003-11-01), Brathwaite et al.
patent: 2004/0268283 (2004-12-01), Perry et al.
patent: 2005/0197807 (2005-09-01), Nelson et al.
AOL, “AOLserver ADP Development”, Sep. 26, 2006. http://www.aolserver.com/docs/devel/tcl/adp-overview.html, pp. 1-8.
CAD User, EDA View and Mark-up, Apr. 2004. http://www.cimmetry.com/brochures/CAD—User—AutoVue—for—EDA.pdf, pp. 1-2.
EMSNOW, “Downstream technologies announces CAM350 release 8.6”, Aug. 19, 2004. http://www.emsnow.com
ewsarchives/archivedetails.cfm?ID=6081, pp. 1-3.
Almeida Richard A.
Newhard William F.
Nikiforenko Sergey
Downstream Technologies, LLC
Iandiorio Teska & Coleman
Whitmore Stacy A
LandOfFree
Automated PCB manufacturing documentation release package... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Automated PCB manufacturing documentation release package..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Automated PCB manufacturing documentation release package... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4005258