Metal fusion bonding – With machine part responsive to template or pattern or to...
Patent
1988-08-04
1990-01-02
Seidel, Richard K.
Metal fusion bonding
With machine part responsive to template or pattern or to...
228 8, 228 9, 228 11, 228 37, 228 20, B23K 304, H05K 334, H05B 716
Patent
active
048907812
ABSTRACT:
A computer controlled flow solder machine is controlled by a computer, operating in conjunction with two other computers, to control the operation of the machine and to control and monitor the process parameters for each circuit board processed through the flow solder machine. The flow solder machine is made up of a conveyer system, a flux system, a preheat system, and a solder pot system.
REFERENCES:
patent: 4363434 (1982-12-01), Flury
patent: 4632291 (1986-12-01), Rahn et al.
patent: 4698774 (1987-10-01), Abe et al.
patent: 4708281 (1987-11-01), Nelson et al.
patent: 4775776 (1988-10-01), Rahn et al.
Johnson Paul B.
Lamb Edwin
Lane Steven R.
Mininger Robert F.
Barndt B. Peter
Comfort James T.
Heinrich Samuel M.
Seidel Richard K.
Sharp Melvin
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