Automated defect spatial signature analysis for semiconductor ma

Details Automated defect spatial signature analysis for semiconductor ma Automated defect spatial signature analysis for semiconductor ma

1997-01-08

1999-11-09

Boudreau, Leo H.

Image analysis

Applications

Manufacturing or product inspection

382224, G06K 900

Patent

active

059829206

ABSTRACT:
An apparatus and method for performing automated defect spatial signature alysis on a data set representing defect coordinates and wafer processing information includes categorizing data from the data set into a plurality of high level categories, classifying the categorized data contained in each high level category into user-labeled signature events, and correlating the categorized, classified signature events to a present or incipient anomalous process condition.

REFERENCES:
patent: 4500789 (1985-02-01), Ban et al.
patent: 4999785 (1991-03-01), Schmuter
patent: 5129009 (1992-07-01), Lebeau
patent: 5256578 (1993-10-01), Corley et al.
patent: 5479252 (1995-12-01), Worster et al.
patent: 5539752 (1996-07-01), Berezin et al.

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