Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1998-03-17
2000-08-08
Ryan, Patrick
Metal fusion bonding
Process
With condition responsive, program, or timing control
228 35, 228214, 228223, B23K 100, B23K 120, B23K 3102
Patent
active
060988673
ABSTRACT:
An automated method of applying flux to substrate on which a semiconductor chip is to be assembled in a flip chip configuration by applying a controlled amount of flux to the substrate by a brush that applies the flux to the substrate in a programmed pattern of strokes thereby overcoming the surface tension of the flux/substrate surface. The programmed pattern of brush strokes is determined empirically for the specific combination of substrate and chip that is being assembled and is thus repeatable and operator independent. The empirically determined program also determines the amount of flux that will be applied to the substrate for the specific combination of substrate and chip being assembled. The empirically determined program is applied to a mechanical stage that moves the brush and to a flux reservoir by a CPU.
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120 USPQ 193 (CCPA 1958), 1958.
Guardado Maria G.
Khan Mohammad Zubair
Master Raj N.
Advanced Micro Devices , Inc.
Nelson H. Donald
Ryan Patrick
Stoner Kiley
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