Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2011-03-08
2011-03-08
Booth, Richard A. (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S612000
Reexamination Certificate
active
07902060
ABSTRACT:
Electronic devices and methods for fabricating electronic devices are described. One method includes providing a first body with a plurality of composite bumps thereon, the composite bumps comprising a solder and magnetic particles. The method also includes applying a magnetic field to the magnetic particles to generate sufficient heat to melt the solder and form molten bump regions containing the magnetic particles therein. The method also includes coupling a second body to the first body through the molten bump regions, and cooling the molten bump regions to form solidified composite bumps coupling the second body to the first body. Other embodiments are described and claimed.
REFERENCES:
patent: 3839727 (1974-10-01), Herdzik et al.
patent: 5048744 (1991-09-01), Chang et al.
patent: 5093545 (1992-03-01), McGaffigan
patent: 5838069 (1998-11-01), Itai et al.
patent: 5907786 (1999-05-01), Shinomiya
patent: 7213329 (2007-05-01), Kim et al.
Calabro, Joshua D., et al. “Magnetically Driven Three-Dimensional Manipulation and Inductive Heating of Magnetic-Dispersion Containing Metal Alloys”, Department of Mechanical Engineering, Yale University, New Haven, CT 06520; and Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, Mar. 16, 2010, vol. 107 No. 11 pp. 4834-4839.
McCormack, M. et al., “Enhanced Solder Alloy Performance by Magnetic Dispersions”, IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part A, vol. 17, No. 3, Sep. 1994, pp. 452-457.
Suwanwatana, W. et al., “Influence of particle size on hysteresis heating behavior of nickel particulate polymer films”, Composites Science and Technology 66, May 30, 2006, pp. 2825-2836.
U.S. Appl. No. 12/787,968, filed May 26, 2010, 29 pages.
U.S. Appl. No. 12/778,335, filed May 12, 2010, 43 pages.
U.S. Appl. No. 12/778,313, filed May 12, 2010, 33 pages.
U.S. Appl. No. 12/777,476, filed May 11, 2010, 41 pages.
U.S. Appl. No. 12/768,842, filed Apr. 28, 2010, 33 pages.
Habib, et al., “Novel Solder-Magnetic Particle Composite and Their Reflow Using AC Magnetic Fields”, IEEE Transactions on Magnetics, vol. 46, No. 6, Jun. 2010, pp. 1-4.
“Yale Scientists Develop Magnetic Lead-free Solder”, SMT Magazine Archive, Mar. 8, 2010, Retrieved on Dec. 6, 2010, Document Available at: <http://www.ems007.com/pages/zone.cgi?a=60208&artpg=1>, 2 pages.
Booth Richard A.
Intel Corporation
Winkle, PLLC
LandOfFree
Attachment using magnetic particle based solder composites does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Attachment using magnetic particle based solder composites, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Attachment using magnetic particle based solder composites will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2782829