Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2005-06-14
2005-06-14
Tran, Thien F (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S779000, C257S780000, C257S783000, C257S784000, C257S785000, C257S786000
Reexamination Certificate
active
06906425
ABSTRACT:
An assembly having a surface mounted electronic device mounted onto a printed circuit board and a thermoplastic adhesive applied to the surface mounted electronic device facing the printed circuit board and providing for a gap between the thermoplastic adhesive and the printed circuit board. The assembly is heated at solder reflow temperatures to at least soften the thermoplastic adhesive sufficiently to flow across the gap and provide a thermoplastic adhesive joint between the surface mounted electronic device and the printed circuit board.
REFERENCES:
patent: 4873397 (1989-10-01), Masujima et al.
patent: 5061549 (1991-10-01), Shores
patent: 5372883 (1994-12-01), Shores
patent: 5401536 (1995-03-01), Shores
patent: 5783867 (1998-07-01), Belke et al.
patent: 5930889 (1999-08-01), Klein
patent: 6037657 (2000-03-01), Tsurumi et al.
patent: 6084781 (2000-07-01), Klein
patent: 6177728 (2001-01-01), Susko et al.
patent: 6238223 (2001-05-01), Cobbley
patent: 6265776 (2001-07-01), Gilleo
patent: 6297560 (2001-10-01), Capote et al.
patent: 6774480 (2004-08-01), Jiang
patent: 19822470 (1999-12-01), None
patent: 0729182 (1996-08-01), None
patent: 057068053 (1982-04-01), None
patent: 03036788 (1991-02-01), None
patent: 04249307 (1992-09-01), None
patent: 04352491 (1992-12-01), None
patent: 05347474 (1993-12-01), None
patent: 08250835 (1996-09-01), None
patent: 10335527 (1998-12-01), None
Adamson, S.J., “CSP and flip chip underfill,” Advanced Packaging, Jun. 2001, pp. 37-44.
Johnson, Zane, “BGA Underfills” Advanced Packaging, Dec. 2001, pp. 29-33.
Alpha Microelectronic: Staystik Adhesive for Mag Heads, [internet]Retrieved on Dec. 19, 2001, URL:www.us-tech.com/april99/prods/cmp/cmp016.htm.
Center for Advanced Vehicle Electronics, “Ball Grid Array Reliability” [Internet] Retrieved on Jan. 8, 2002, URL:www.eng.auburn.edu/department/ee/cave/bgareliability.html.
Brofman, P.J., “Effect of Underfill Properties on Flip Chip Plastic BGA (FC-PBGA) Reliability,” IPC, Session P-MT1/5-(1-5); Presented at Apex 2000, Mar. 14-16, 2000; Long Beach Convention Center, Long Beach, CA.
Adamson, Steven J, “When to Underfill Chip Scale Packages, Design Consideration for Portable Electronic Applications,” IPC, Session P-AD2/2-(1-8); Presented at Apex 2000, Mar. 14-16, Long Beach Convention Center.
Ghaffarian, R., “Impact of CSP Assembly Underfill Reliability,” IPC, Session P-AD2/3-(1-7); Presented at Apex 2000, Mar. 14-16, Long Beach Convention Center.
Yaeger, E., “Beyond Flip-Chip, Underfills Enhance CSP Reliability,” Chip Scale Review, Mar. 2001, pp. 61-66.
Katze, D., “Evaluations of No-Flow Fluxing Underfills with BGA, CSP and Flip Chip on Board Assemblies,” IPC, Session P-MT1/2-(1-7), Presented at Apex 2000, Long Beach Convention Center.
Gilleo, K., “Thermoplastic Die Attach Adhesive for Today's Packaging Challenges,” [internet] URL: http://www.cooksonsemi.com/tech_art/staystik.htm.
Hannan, N., “Critical Aspects of Reworkable Underfills for Portable Consumer Products,” 2001 Electronic Components and Technology Conference, 2001 IEEE, pp 181-187.
Chapter C: Conductive Polymers, Level 1: Introduction [internet], last updated on Sep. 7, 2000; URL:http://extra.ivf.se
gl/C-polymerBonding/ChapterC.htm.
Kristiansen, H., “Adhesives in Electronics,” Chalmers Tekniska Hogskola, SINTEF Microelectronics; Presented at International Microelectronics and Packaging Society, Flipchip Technology Workshop, Jun. 18-20, 2001.
Tong, Q., “Novel Fast Cure and Reworkable Underfill Materials,” 1999 Electronic Components and Technology Conference, 0-7803-5234-3/99, 1999 IEEE, pp.
Nguyen, L., “Reworkable Flip Chip Underfill-Materials and Processes,” Proc. IMAPS International Symposium on Microelectronics, pp. 707-713 (1998).
Gilleo, K., “The Great Underfill Race,” [internet] URL:http://www.cooksonsemi.com/tech_art/polysolder.htm.
Gilleo, K., “Wafer-Level Flux Underfill: Underflip,” Presented at Apex 2000, Mar. 14-16, 2000; Long Beach Convention Center; Session P-MT1/4-(1-5).
Thorpe, R., “Low Cost Flip Chip Processing Utilizing No Flow Underfill Materials,”Presented at Apex 2000, Mar. 14-16, 2000; Long Beach Convention Center; Session P-AP3/3-(1-8).
Hackett, S., “A No-flow Underfill With Excellent Reliability Performance,” IMAPS Flip Chip 2001 Austin, Texas Jun. 18-19, 2001.
Suzuki, O., Research on the Development of Advanced Non Conductive Paste (ANCP), Imaps Conference on Flip Chip Technology in Austin, Texas; Jun. 18-19, 2001.
PRC Research Project Summaries, Flip Chip Assembly Thrust, [internet] Obtained Oct. 31, 2001, URL: www.ee.gatech.edu/research/PRC/research/projsummary/asm.htm.
Emerson, J., “Techniques for Determining the Flow Properties of Underfill Materials,” 1999 electronic Components and Technology Conference, 0-7803-5234-3/99.
Fine, P., “Flip Chip Underfill Flow Characteristics and Prediction,” 1999 Electronic Components and Technology Conference, 0-7803-5234-3/99.
The National Technology Roadmap for Electronic Interconnections, Part C-Section I-Package Style and Physical Attributes, Roadmap 2000/2001; C1-6.
The National Technology Roadmap for Electronic Interconnections, Part D-Section 1-Organic Interconnecting Structures, Roadmap 2000/2001; D1-15.
Goyal, S, “Role of Shock Response Spectrum in Electronic Product Suspension Design,” The International Journal of Microcircuits and Electronic Packaging, vol. 23, No. 2, Second Quarter 2000, pp 182-190.
Yamaji, Y., “A proposal: the Assessing Method of the CSP's Mechanical Reliability on Board,” The International Journal of Microcircuits and Electronic Packaging, vol. 23, No. 1, First Quarter 2000, pp 138-145.
Goyal, S, “Methods for Realistic Drop-Testing,” The International Journal of Microcircuits and Electronic Packaging, vol. 23, No. 1, First Quarter 2000, pp. 45-52.
Xu, K., “A General Purpose Adhesive for Microelectronic Devices,” The International Journal of Microcircuits and Electronic Packaging, vol. 23, No. 1, First Quarter 2000, pp. 78-84.
Seppala, A, “Flip Chip Joining on GR-4 Substrate Using ACFs,” The International Journal of Microcircuits and Electronic Packaging, vol. 24, No. 2, Second Quarter 2001, pp. 148-159.
Swirbel, T., “Chip Scale Package and Multichip Module Impact on Substrate Requirements for Portable Wireless Products,” The International Journal of Microcircuits and Electronic Packaging, vol. 23, No. 3, Third Quarter 2000, pp. 320-324.
Gilleo, K., “Thermoplastic Adhesives—The Attachment Solution For Multichip Modules,” [internet] URL: http://www.cooksonsemi.com/tech_art/staystik.htm.
Gilleo, K., “New Generation Underfills Power The 2ndFlip Chip Revolution,” [internet] URL: http://www.cooksonsemi.com/tech_art/polysolder.htm.
Hung,S.C., “Board Level Reliability of Chip Scale Packages,” The International Journal of Microcircuits and Electronic Packaging, vol. 23, No. 1, First Quarter 2000, pp. 118-130.
Gilleo, K., “Transforming Flip Chip into CSP with Reworkable Wafer-Level Underfill,” [internet] URL: http://www.cooksonsemi.com/tech_art/staychip.htm.
Gilleo, K, “The Ultimate Flip Chip-Integrated Flux/Underfill,” [internet] http://www.cooksonsemi.com/tech_art/staychip.htm.
Preveti, M., “No Flow Underfill Reliability is Here,” [internet] URL:http://www.cooksonsemi.com/tech_art/staychip.htm.
Gilleo, K., “The Chemistry & Physics of Underfill,” [internet] URL: http://www.cooksonsemi.com/tech_art/staychip.htm.
Harper, P., “Thermoplastic Die Attach For Hermetic Packaging,” The International Journal of Microelectronics and Electronic Packaging, vol. 17, No. 4, Fourth Quarter, 1994, pp.
Gilleo, K., “Molded Underfill for Flip Chip in Package,” [internet]Jun., 2000; URL: http://www.cookso
Ash Carlton E.
Stewart Steven L.
Resolution Performance Products LLC
Tran Thien F
LandOfFree
Attachment of surface mount devices to printed circuit... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Attachment of surface mount devices to printed circuit..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Attachment of surface mount devices to printed circuit... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3512543