Attachment of solder preform to a cover for a sealed container

Details Attachment of solder preform to a cover for a sealed container Attachment of solder preform to a cover for a sealed container

1980-06-02

1982-05-11

Weidenfeld, Gil

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228254, 228240, B23K 114

Patent

active

043289215

ABSTRACT:
A method is described for attaching a preformed solder ring to a cover used to hermetically seal a container for a semiconductor device. The surface of the preformed solder ring that engages the cover is caused to melt and bond to the cover on solidification while the opposite surface of the ring is maintained relatively cool in a solid state by abutment against the flat surface of a cooling block.

REFERENCES:
patent: 3451836 (1969-06-01), Spooner et al.
patent: 3538597 (1970-11-01), Leinkram
patent: 3648357 (1972-03-01), Green, Jr.
patent: 3937388 (1976-02-01), Zimmerman
patent: 3943620 (1976-03-01), Sawehuk
patent: 3985283 (1976-10-01), Gempler
patent: 4020987 (1977-05-01), Hoscoe

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