Asymmetric transfer molding method and an asymmetric...

Details Asymmetric transfer molding method and an asymmetric... Asymmetric transfer molding method and an asymmetric...

2005-10-04

2005-10-04

Dinkins, Anthony (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C438S112000, C438S124000

Reexamination Certificate

active

06951981

ABSTRACT:
A method of encapsulating an article having first and second surfaces, includes positioning a first molding section in a sealing relationship with the first surface of the article and positioning a second molding section adjacent the second surface of the article. The first molding section is filled first thereby forcing the second surface of the article into a sealing engagement with the second molding section. The second molding section is then filled.

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