Asymmetric plating

Details Asymmetric plating Asymmetric plating

2007-08-14

2007-08-14

Zimmerman, John J. (Department: 1775)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C427S123000, C427S438000

Reexamination Certificate

active

10930510

ABSTRACT:
A method and apparatus are disclosed for forming a tapered contact structure over a contact pad. The tapered contact structure may be used to securely anchor an overlying solder bump or solder ball. Additionally, the tapered contact structure allows the use of either larger contact pads or, alternately, allows a greater density of contact pads to be achieved on an integrated circuit substrate.

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